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Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft

Shenzhen Aochuan Technology Co., Ltd
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Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft

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Brand Name : AOK

Model Number : TP

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 1000pcs

Payment Terms : T/T

Delivery Time : 13-15 working days

Packaging Details : 400 mm x 200 mm

Product Name : Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone

Composition : Silicone

Density(g/cc) : 3.35

Thermal conductivity : 8.0±0.5(W/m.K)

Color : Blue

Volume Resistivity : 1.0*10^12(Ω.cm)

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Ultra Soft 8.0W/m.K Thermal Conductivity Thermal Pad Material With Blue Silicone

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Heatproof Thermal Pad Material Multipurpose Odorless Ultra Soft


Product Tags:

Heatproof Thermal Pad Material

      

Multipurpose Thermal Pad Material

      

Odorless Soft Thermal Pads

      
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